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Design Rule Verification Report

Date : 2/12/2014
Time : 9:36:06 PM
Elapsed Time : 00:00:17
Filename : D:\MCCB_OPAMP\WORK\MCCB_OPAMP_FEB_12_2014\MCCB_OPAMP_1.PcbDoc
Warnings : 0
Rule Violations : 17

ERROR : Design Rule Check was aborted

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=40mil) (InPadClass('MTG')),(InPolygon) 0
Clearance Constraint (Gap=7.9mil) (InPadClass('U5')),(InPadClass('U5')) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsVia) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin) 15
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_2')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InDifferentialPair('RS485_2')) 0
Clearance Constraint (Gap=20mil) (InPolygon),(InPolygon) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=12mil) (Max=12mil) (Preferred=12mil) (InDifferentialPair ('RS485_1')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InDifferentialPair('RS485_1')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=10mil) (InNetClass('RS485')) 0
Clearance Constraint (Gap=12mil) (InNetClass('RS485')),(InNetClass('RS485')) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Routing Via (MinHoleWidth=7.874mil) (MaxHoleWidth=12mil) (PreferredHoleWidth=7.874mil) (MinWidth=19.685mil) (MaxWidth=26mil) (PreferedWidth=19.685mil) (IsVia and InAnyComponent) 0
Net Antennae (Tolerance=0mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=10mil) (Max=100mil) (Preferred=10mil) (All) 0
Hole Size Constraint (Min=8mil) (Max=251mil) (All) 0
Minimum Annular Ring (Minimum=7mil) (All) 0
Un-Routed Net Constraint ( (All) ) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Routing Via (MinHoleWidth=12mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=16mil) (MinWidth=26mil) (MaxWidth=40mil) (PreferedWidth=32mil) (All) 0
Routing Layers(All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Width Constraint (Min=6mil) (Max=100mil) (Preferred=10mil) (All) 0
Clearance Constraint (Gap=40mil) (OnCopper and InComponentClass('Mounting Holes')),(IsKeepOut) 0
Clearance Constraint (Gap=25mil) (OnCopper and InPoly),(IsKeepOut) 0
Clearance Constraint (Gap=75mil) (OnCopper and Not InComponentClass('Logo') and not InComponentClass('FiducialMark') and not InRegion(1000,500,4000,800) and Not IsKeepout),(IsKeepOut) 2
Clearance Constraint (Gap=8mil) (All),(All) 0
Clearance Constraint (Gap=15mil) (InPolygon),(All) 0
Clearance Constraint (Gap=12mil) (IsVia),(IsThruPin) 0
Clearance Constraint (Gap=22mil) (InNet('18V')),(All) 0
Total 17

Clearance Constraint (Gap=12mil) (IsVia),(IsSMTPin)
Via (3416mil,2868.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3416mil,2770.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3416mil,2966.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3318mil,2868.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3220mil,2868.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3318mil,2770.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3220mil,2770.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3318mil,2966.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3220mil,2966.94mil) Top Layer to Bottom Layer Pad U3-2(3318mil,2868.94mil) Top Layer
Via (3411.378mil,2433.622mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3411.378mil,2386.378mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3458.622mil,2433.622mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (3458.622mil,2386.378mil) Top Layer to Bottom Layer Pad U4-9(3435mil,2410mil) Top Layer
Via (405mil,1765mil) Top Layer to Bottom Layer Pad U5-17(420.1mil,1750.3mil) Top Layer
Via (435mil,1735mil) Top Layer to Bottom Layer Pad U5-17(420.1mil,1750.3mil) Top Layer
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Clearance Constraint (Gap=75mil) (OnCopper and Not InComponentClass('Logo') and not InComponentClass('FiducialMark') and not InRegion(1000,500,4000,800) and Not IsKeepout),(IsKeepOut)
Region (0 hole(s)) Keep-Out Layer Pad H3-1(1377.953mil,1968.504mil) Multi-Layer
Track (3942.008mil,-5mil)(3942.008mil,3948mil) Keep-Out Layer Pad C9-2(3842.087mil,3005mil) Top Layer
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